Non-volatile semiconductor memory device with multi-layer gate structure

ABSTRACT

A semiconductor device includes a semiconductor substrate, source and drain regions, a channel region, a gate insulating film, a charge storage layer, and a control gate electrode. The source and drain regions include first impurities of a first conductivity type. The channel region includes second impurities of a second conductivity type. The gate insulating film includes the second impurities in a region thereof located immediately above at least a portion of the channel region. The charge storage layer is formed on the gate insulating film. The control gate electrode is provided on the charge storage layer. The control gate electrode is formed on the charge storage layer and is electrically connected to the charge storage layer by a connection portion provided on a part of the charge storage layer, which is located immediately above at least a part of the region of the gate insulating film including the second impurities.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Applications No. 2001-158066, filed May 28,2001; No. 2001-201366, filed Jul. 2, 2001; No. 2002-143481, filed May17, 2002; and No. 2002-150853, filed May 24, 2002, the entire contentsof all of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device and a method ofmanufacturing the same. In particular, the invention relates to a veryfine semiconductor device with a transistor having a channel region inwhich impurities are implanted. In addition, the invention relates to astructure of a row core circuit in a NAND type flash memory.

2. Description of the Related Art

Recently, EEPROMs (Electrically Erasable Programmable Read Only Memory)have been known as non-volatile semiconductor memories capable ofelectrically writing and erasing data. EEPROMs include a flash memorycapable of effecting electrical batch-erase. In particular, NAND typeflash memories, which permit easy realization of higher integration, arewidely used.

Manufacturing methods of conventional NAND type flash memories areproposed, for instance, in S. Aritome, et al., IEDM (1994) pp. 61-64, “A0.67 μm² SELF-ALIGNED SHALLOW TRENCH ISOLATION CELL (SA-STI CELL) FOR3V-only 256 Mbit NAND EEPROMs”; or Y. Takeuchi, et al., 1998 Symposiumon VLSI Technology Digest of Technical Papers, pp. 102-103, “ASelf-Aligned STI Process Integration for Low Cost and Highly Reliable 1Gbit Flash Memories.” According to these proposals, an element isolationregion between memory cells is formed by STI (Shallow Trench Isolation)technology. A floating gate is formed so as to have a self-alignedstructure (SA-STI) relative to the element isolation region. Thereby, amemory cell array comprising fine memory cells arranged with highdensity is realized. In the manufacturing process, the element isolationregion is formed after a gate oxide film and a part or all of a floatinggate electrode material have been formed. In addition, impurities areintroduced by ion implantation into channel regions of transistors usedfor memory cells and a peripheral control system, before the gate oxidefilm is formed. Thereafter, the gate insulating film is formed. Thermaldiffusion of the introduced impurities is effected by heat treatment ina subsequent step of forming the element isolation region. Theimpurities are activated by the thermal diffusion.

In the NAND type flash memory, when data “1” is written in the memorycell (i.e. a threshold voltage for data erase state is kept withoutintroducing electrons in the floating gate), the bit line is chargedwith initial potential. In addition, a write voltage is applied to theselected word line, and a transfer voltage is applied to the unselectedword line. The potential of the channel region of the memory celltransistor is raised by capacitive coupling, thereby preventinginjection of electrons in the floating gate. If the impurityconcentration of the channel region is lowered, the channel capacitancedecreases and the channel region potential tends to rise easily. As aresult, the characteristics of write of data “1” in the memory cell areenhanced.

Several methods of fabricating flash memories have been proposed,considering the above write operation and paying attention to thecontrol of impurity concentrations in channel regions of memory celltransistors. For example, Jpn. Pat. Appln. KOKAI Publication No.2002-009173 discloses a method wherein a gate oxide film and an elementisolation region are successively formed, following which ionimplantation is effected through the gate oxide film and a floatinggate. According to this method, the impurity concentration profile inthe channel region is not affected by heat treatment in an elementisolation region forming step. Accordingly, a steep profile of impurityconcentration can be realized. Thus, even if the channel length isdecreased, the impurity concentration in the channel region can besufficiently controlled.

U.S. patent application Ser. No. 10/058,343 (corresponding to JapanesePatent Application No. 2001-23973) presents a proposal relating mainlyto a NAND type flash memory. Specifically, it discloses a method whereinafter a mask is formed on a memory cell transistor, impurities areobliquely ion-implanted in an impurity diffusion layer between adjacentselect transistors. According to this method, the impurity concentrationin the channel region of the memory cell transistor is made equal tothat in the channel region of the select transistor, and thecharacteristics of the select transistor can easily be controlled.

U.S. patent application Ser. No. 09/956,986 (corresponding to JapanesePatent Application No. 2000-291910) also presents a proposal relating toa NAND type flash memory. Specifically, it discloses a method ofremoving an inter-gate insulating film that isolates a floating gate anda control gate in gate electrodes of a peripheral control systemtransistor and a select transistor. Thereby, the floating gate andcontrol gate can be electrically connected.

Jpn. Pat. Appln. KOKAI Publication No. 59-74677 discloses, as shown inFIGS. 4-11, that an opening portion is made in an insulating filmbetween a floating gate and a control gate in a peripheral transistor.This increases the degree of freedom in designing wiring.

As has been described above, various proposals have been presented withrespect to methods of manufacturing flash memories. However, in the caseof the method of forming an element isolation region after the formationof a channel region, impurities in the channel region tend to easilydiffuse, and miniaturization of the channel length of the transistorbecomes difficult. The reason is that many thermal steps exist after theformation of the channel region. This problem is conspicuous, inparticular, when the gate length of the memory cell transistor is lessthan about 0.2 μm.

On the other hand, as the degree of miniaturization progresses, itbecomes difficult to carry out the method wherein the ion implantationin the channel region of the memory cell transistor and the ionimplantation in the channel region of the select transistor areperformed in different steps. Moreover, since the number of lithographicsteps increases, the total number of fabrication steps increases. Thismethod is hardly feasible, for example, when a very fine, high-densitymemory cell unit is to be formed, which would have a channel length ofabout 0.3 μm or less of the select transistor and a channel length ofabout 0.15 μm or less of the memory cell transistor.

However, if the impurity region in the channel region of the memory celltransistor and the impurity region in the channel region of the selecttransistor are to be formed at the same time, it is difficult toincrease the impurity concentration in the channel region of the selecttransistor. As a result, the cut-off characteristics of the selecttransistor may deteriorate. In other words, there is no choice but toset the impurity concentration in the channel region of the selecttransistor at a concentration value that satisfies memory cellcharacteristics necessary for the memory cell transistor. Thisconcentration value is usually lower than the concentration necessaryfor the select transistor. In short, there is no choice but to set theimpurity concentration in the channel region of the select transistor ata concentration value lower than an ideal value. Consequently, theselect transistor may not normally operate because the threshold voltagedecreases and an off-leak current increases. The memory cellcharacteristics in this context refer to data retention characteristics,write/erase characteristics and the degree of degradation incharacteristics due to write/erase.

In the NAND type flash EEPROM, like other semiconductor devices such asDRAMs (Dynamic Random Access Memories) or SRAMs (Static RAMs), one wordline is selected by a row decoder, and data write/read is effected for aselected memory cell (page). The row decoder comprises a row maindecoder circuit and a row core circuit (row sub-decoder circuit). Inaccordance with row address signals, the row main decoder circuitgenerates predetermined voltages to be applied to control gate lines andselect gate lines in the memory cell array. The row core circuitfunctions as a switch between the row main decoder circuit and thememory cell array.

The structure of the row core circuit will now be described withreference to FIGS. 1A and 1B. FIG. 1A is a plan view of the row corecircuit, and FIG. 1B is a cross-sectional view taken along line 1B-1B inFIG. 1A.

As is shown in the Figures, a plurality of active areas AA (Active Area)are provided in matrix on a silicon substrate 200. Element isolationregions STI are provided between adjacent active areas AA. Transfer gatetransistors TGTD, TGTS, TGT, TGT, . . . , are formed on the electricallyisolated active regions AA. Each of the transfer gate transistors TGTD,TGTS, TGT, TGT, . . . , has a gate electrode TG and impurity diffusionlayers (not shown). The gate electrode TG is provided on a gateinsulating film 210 on the active area AA. The gate electrode TGcomprises a polysilicon film 220 and a polysilicon film 240 providedover the polysilicon film 220 via an inter-gate insulating film 230. Thepolysilicon films 220 and 240 are electrically connected on the activearea AA. Interlayer insulating films 260 and 280 are provided so as tocover the transfer gate transistors TGTD, TGTS and TGT.

Gate electrodes TG of transfer gate transistors TGTD, TGTS and TGTprovided in the active areas AA of the same row are commonly connected.Impurity diffusion layers (drain regions) on one side of the transfergate transistors TGTD, TGTS and TGT are connected to a drain-side selectgate line SGD, a source-side select gate line SGS and control gate linesCG, respectively. More specifically, the select gate lines SGD and SGSand control gate lines CG are led into the row core circuit by shuntwiring 290 provided in the interlayer insulating film 260, and connectedto the impurity diffusion layers of the associated transfer gatetransistors TGTD, TGTS and TGT via contact holes C20. Impurity diffusionlayers (source regions) on the other side of the transfer gatetransistors TGTD, TGTS and TGT are supplied with predetermined voltagesfrom the row main decoder via metal wiring layers 300.

FIG. 1C is an enlarged view of FIG. 1B. As is shown in FIG. 1C, aparasitic MOS transistor exists in a region between adjacent activeareas AA arranged along the control gate line. The parasitic MOStransistor is formed, with the polysilicon film 240 serving as a gateelectrode thereof, and the gate insulating film 230 and elementisolation region STI as a gate insulating film thereof. A high voltageVpgm is applied to the gate electrodes TG to turn on the transfer gatetransistors TGTD, TGTS and TGT. At this time, the parasitic MOStransistor may be turned on. In such a case, an inversion region CHforms in the vicinity of the element isolation region STI. Consequently,adjacent active areas AA arranged with the element isolation region STIinterposed may be rendered conductive.

The transfer gate transistors TGT are designed such that a turned-ontransfer gate transistor TGT and a turned-off transfer gate transistorTGT may not be arranged adjacent to each other in the same row. In otherwords, the control gate lines connected to the transfer gate transistorsTGT provided in the same row are designed such that adjacent controlgate lines are not set in the selected state and unselected state. Thereason is as follows. At the time of data write, in particular, a highvoltage Vpgm is applied to the active area AA (impurity diffusion layer)of the selected transfer gate transistor TGT. On the other hand, 0V isapplied to the active area AA of the unselected transfer gate transistorTGT. If the potential difference increases between the adjacent activeareas AA, insulation therebetween cannot be maintained.

However, in the case where the transfer gate transistors TGTD and TGTSconnected to the select gate lines SGD and SGS and the transfer gatetransistors TGT connected to the control gate lines CG are provided inthe same row, it is difficult to avoid such a situation from occurring,that both transistors have the relationship of selection andnon-selection.

This situation will be described with reference to FIG. 1C. As shown inFIG. 1C, the transfer gate transistor TGT connected to the selectedcontrol gate line CG and the transfer gate transistor TGTD connected tothe unselected select gate line SGD are arranged adjacent to each otherin the same row. In this case, both active areas AA have a highpotential Vpgm and a ground potential GND, with the element isolationregion STI interposed. In addition, the polysilicon film 240, whichbecomes part of the gate electrode TG, is present on the elementisolation region STI. The polysilicon film 240 is supplied with the highvoltage Vpgm to turn on the transfer gate transistors TGTD and TGT. Inthis case, a potential difference between both active areas AA exceedsthe withstand voltage of the element isolation region STI. As a result,the element isolation region STI may not maintain electrical insulationbetween the active areas AA.

The problem with the element isolation may be solved by increasing thewidth d10 (see FIG. 1A) of the element isolation region STI in thedirection of the control gate line CG. However, there are locations atrandom, where the transfer gate transistors TGT and the transfer gatetransistors TGTD and TGTS are arranged adjacent to each other in thedirection of control gate lines. In order to solve the problem, it isthus necessary to increase the width d10 of element isolation regionsover the entire area of the row core circuit. If this is done, the areaof the row core circuit increases and the NAND type flash EEPROM cannotbe reduced in size.

BRIEF SUMMARY OF THE INVENTION

A semiconductor device according to an aspect of the present inventioncomprises:

-   -   a semiconductor substrate;    -   source and drain regions formed in the semiconductor substrate        and including first impurities of a first conductivity type;    -   a channel region formed in the semiconductor substrate between        the source and drain regions and including second impurities of        a second conductivity type;    -   a gate insulating film formed on the semiconductor substrate and        including the second impurities in a region thereof located        immediately above at least a portion of the channel region;    -   a charge storage layer formed on a part of the gate insulating        film, which is located above the channel region; and    -   a control gate electrode provided on the charge storage layer,        and electrically connected to the charge storage layer by a        connection portion provided on a part of the charge storage        layer, which is located immediately above at least a part of the        region of the gate insulating film including the second        impurities.

A semiconductor device according to another aspect of the presentinvention comprises:

-   -   a first active area group including a plurality of active areas        that are electrically isolated by element isolation regions and        provided in a first direction;    -   a second active area group including a plurality of the first        active area groups, which are electrically isolated by element        isolation regions and provided in a second direction        perpendicular to the first direction; and    -   a MOS transistor provided in each of the active areas, the MOS        transistor having a gate electrode commonly connected among the        plurality of first active area group, a first impurity diffusion        layer connected to one of a control gate for a memory cell and a        select gate of a select transistor, and a second impurity        diffusion layer supplied with a voltage from a row decoder, the        MOS transistor connected to the select gate being provided only        in the active area located at an end portion of the second        active area group, and a width of the element isolation region        between the first active area group including the MOS transistor        connected to the select gate and the adjacent first active area        group being greater than a width of the element isolation region        between the first active area groups including only the MOS        transistors connected to the control gates.

A method for fabricating a semiconductor device according to anotheraspect of the invention comprises:

-   -   implanting impurities of a first conductivity in a surface of a        semiconductor substrate at a first concentration;    -   forming a gate insulating film on the surface of the        semiconductor substrate;    -   forming a charge storage layer on the gate insulating film;    -   forming a element isolation region in the semiconductor        substrate and the gate insulating film;    -   forming an inter-gate insulating film on the element isolation        region and the charge storage layer;    -   forming on the inter-gate insulating film a mask material having        an opening portion which exposes at least a part of a surface of        the inter-gate insulating film;    -   implanting impurities of the first conductivity type in the        semiconductor substrate via the opening portion in the mask        material at a second concentration higher than the first        concentration;    -   removing the inter-gate insulating film that is exposed to the        opening portion in the mask material;    -   forming a control gate electrode on the inter-gate insulating        film, the control gate electrode being connected to the charge        storage layer via a region where the inter-gate insulating film        has been removed;    -   forming a stacked gate electrode by patterning the charge        storage layer, the inter-gate insulating film and the control        gate electrode; and    -   forming source and drain regions by implanting impurities of a        second conductivity type in the semiconductor substrate around        the gate electrode.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1A is a plan view of a conventional NAND type flash memory;

FIG. 1B is a cross-sectional view taken along line 1B-1B in FIG. 1A;

FIG. 1C is an enlarged view of FIG. 1B;

FIG. 2A is a cross-sectional view of a flash memory according to a firstembodiment of the present invention;

FIG. 2B is a graph showing a p-type impurity concentration profile in achannel region of select transistor shown in FIG. 2A;

FIG. 3A is a circuit diagram of a NAND type flash memory according tothe first embodiment of the invention;

FIG. 3B is a plan view of the NAND type flash memory according to thefirst embodiment of the invention;

FIG. 3C is a cross-sectional view taken along line 3C-3C in FIG. 3B;

FIG. 3D is a graph showing a variation in threshold voltage relative toa channel length, in a select transistor and a memory cell transistorincluded in the NAND flash memory according to the first embodiment ofthe invention;

FIGS. 4A and 4B through FIGS. 15A and 15B are cross-sectional viewssuccessively showing manufacturing steps of the NAND type flash memoryaccording to the first embodiment of the invention;

FIGS. 16A and 16B are cross-sectional views successively illustratingsome manufacturing steps of a NAND type flash memory according to afirst modification of the first embodiment;

FIGS. 16C and 16D are cross-sectional views successively illustratingfabrication steps of a semiconductor device according to a secondmodification of the first embodiment;

FIG. 17 is a cross-sectional view of a NAND type flash memory accordingto a third modification of the first embodiment of the invention;

FIG. 18 is a circuit diagram of an AND type flash memory according to asecond embodiment of the present invention;

FIG. 19A is a block diagram showing a part of the internal structure ofa NAND type flash memory according to a third embodiment of theinvention;

FIG. 19B is a circuit diagram of a memory cell array and a row corecircuit included in the NAND flash memory according to the thirdembodiment;

FIG. 19C is a plan view of a memory cell array and a row core circuitincluded in the NAND flash memory according to the third embodiment;

FIG. 19D is a cross-sectional view taken along line 19D-19D in FIG. 19C;

FIG. 19E is a cross-sectional view taken along line 19E-19E in FIG. 19C;

FIG. 19F is a cross-sectional view taken along line 19F-19F in FIG. 19C;

FIG. 19G is a cross-sectional view taken along line 19G-19G in FIG. 19C;

FIG. 20A is a table showing gate voltages of transistors in the write,read and erase modes of the NAND type flash memory according to thethird embodiment of the invention;

FIG. 20B through FIG. 20D are circuit diagrams of a NAND type flashmemory according to the first embodiment of the invention;

FIG. 21A is a plan view of a memory cell array and a row core circuit ofthe NAND type flash memory according to the third embodiment of theinvention;

FIG. 21B is a cross-sectional view taken along line 21B-21B in FIG. 21A;

FIG. 22A is a plan view of a row core circuit of a NAND type flashmemory according to a fourth embodiment of the invention;

FIG. 22B is a cross-sectional view taken along line 22B-22B in FIG. 22A;

FIG. 22C is a cross-sectional view taken along line 22C-22C in FIG. 22A;

FIG. 23A is a plan view of a row core circuit of a NAND type flashmemory according to a fifth embodiment of the invention;

FIG. 23B is a cross-sectional view taken along line 23B-23B in FIG. 23A;

FIG. 24 is a plan view of a row core circuit of a NAND type flash memoryaccording to a sixth embodiment of the invention; and

FIG. 25 and FIG. 26 are plan views of a row core circuit of a NAND typeflash memory according to a seventh embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

A semiconductor device according to a first embodiment of the presentinvention will now be described with reference to FIG. 2A. FIG. 2A is across-sectional view of the semiconductor device.

As is shown in FIG. 2A, a memory cell transistor 2 and a selecttransistor 3 are provided on a semiconductor substrate 1. The memorycell transistor 2 has source/drain regions 4 and 5 provided in thesemiconductor substrate 1. The memory cell transistor 2 has a gateelectrode 7 provided on the semiconductor substrate 1 between thesource/drain regions 4 and 5 with a gate insulating film 6 interposedtherebetween. The gate electrode 7 comprises a charge storage layer(floating gate) 8 formed directly on the gate insulating film 6, aninter-gate insulating film 9 formed on the charge storage layer 8, and acontrol gate 10 formed on the inter-gate insulating film 9. A channeldiffusion layer 11 is formed near the surface of the semiconductorsubstrate 1 between the source/drain regions 4 and 5.

The select transistor 3 is provided adjacent to the memory celltransistor 2. The select transistor 3 has source/drain regions 5 and 12provided in the semiconductor substrate 1. Of the source/drain regions 5and 12, the source/drain region 5 closer to the memory cell transistor 2is commonly connected to the source/drain region 5 of the memory celltransistor 2. The select transistor 3 has a gate electrode 13 providedon the semiconductor substrate 1 between the source/drain regions 5 and12 with the gate insulating film 6 interposed therebetween. The gateelectrode 13 comprises a charge storage layer (floating gate) 14 formeddirectly on the gate insulating film 6, an inter-gate insulating film 15formed on the charge storage layer 14, and a control gate electrode 17formed on the inter-gate insulating film 15. An opening portion 16 isformed in the inter-gate insulating film 15. The opening portion 16 isfilled with the same electrically conductive material as the controlgate electrode 17. The opening portion 16 serves as a connection portionfor electrical connection between the control gate electrode 17 andcharge storage layer 14. A channel diffusion layer 18 is formed near thesurface of the semiconductor substrate 1 between the source/drainregions 5 and 12 such that the channel diffusion layer 18 contacts thesource/drain regions 5 and 12. In addition, a channel diffusion layer 19is formed near the surface of the semiconductor substrate 1 immediatelybelow the opening portion 16, and the channel diffusion layer 19 issurrounded by the channel diffusion layer 18. The channel diffusionlayer 18 is formed to have the same impurity concentration and sameimpurity concentration profile in the direction vertical to thesemiconductor substrate 1 as that of the memory cell transistor 2. Thechannel diffusion layer 19 has a higher impurity concentration than thechannel diffusion layer 18 and has a greater depth than the channeldiffusion layer 18. The gate electrode 13 of select transistor 3 has aheight substantially equal to the height of the gate electrode 7 ofmemory cell transistor 2. The inter-gate insulating film 9, 15 is formedof, e.g. an ONO (Oxide-Nitride-Oxide) film that is a multilayer film ofsilicon oxide film, a silicon nitride film and a silicon oxide film.Thus, in the select transistor 3, a potential can be supplied from theoutside to the charge storage layer 14. In other words, the selecttransistor 3 functions like an ordinary MOSFET. Furthermore, the stackedgate structure of the select transistor 3 is the same as that of thememory cell transistor 2 except for the presence of the opening portion16.

When this embodiment is applied to a flash memory, the length of thegate electrode 7 of memory cell transistor 2 and the length of thechannel region interposed between the source/drain regions 4 and 5 are,in usual cases, less than the length of the gate electrode 13 of selecttransistor 3 and the length of the channel region interposed between thesource/drain regions 5 and 12. Of course, depending on productspecifications, the channel length of the select transistor 3 maybecomes less than the channel length of the memory cell transistor 2. Inother words, the length of the gate electrode 7 of memory celltransistor 2 may be greater than that of the gate electrode 13 of selecttransistor 3. Besides, depending on product specifications, the channellength of select transistor 3 may be made equal to the channel length ofmemory cell transistor 2.

The size of the opening portion 16 is about half the length of the gateelectrode 13 of select transistor 3. For example, if the length of gateelectrode 13 is about 0.3 μm, the length of opening portion 16 is about0.15 μm. If the length of gate electrode 7 of memory cell transistor 2is about 0.15 μm, the channel length thereof is about 0.15 μm and thelength of the entire channel region of select transistor 3 is about 0.3μm. The length of the channel region 11 of memory cell transistor 2 ismade less than the sum of the lengths of channel diffusion layer 18 andchannel diffusion layer 19 of the select transistor 3.

The length of the channel diffusion layer 19 of select transistor 3 canbe varied by controlling the length of the opening portion 16. Inaddition, the impurity concentration of the channel diffusion layer ofselect transistor 3 can freely be set by controlling the dosage of ionsimplanted below the gate electrode 13 through the opening portion 16,independently of the memory cell transistor 2. The impurityconcentration of the channel region of the select transistor 3 is, e.g.about 10¹⁷/cm³.

FIG. 2B shows a p-type impurity concentration profile in a channelregion of select transistor 3 shown in FIG. 2A. As is shown in FIG. 2B,the impurity concentration takes a maximum value in a region just belowthe opening portion 16, i.e. a region including a central portion of thechannel region.

As has been described above, according to the semiconductor device ofthe present embodiment, the memory cell transistor with a gate length ofabout 0.15 μm or less can be realized. Moreover, the select transistorwith a gate length of about 0.3 μm or less can be realized. Accordingly,a semiconductor memory device with a finer structure than in the priorart can be provided. While increasing the degree of miniaturization, thecut-off characteristics of the select transistor can be enhanced. Theselect transistor and memory cell transistor, which have differentchannel-length-dependency of threshold voltage, can be realized. In FIG.2A, the impurity regions 4, 5, 11, 12, 18 and 19 of the respectivetransistors 2 and 3 may be formed in well regions formed near thesurface of the semiconductor substrate 1.

FIG. 3A is a circuit diagram of a memory cell array of a NAND type flashmemory using the semiconductor device shown in FIG. 2A. A non-volatilememory cell MC shown in FIG. 3A has the same structure as the memorycell transistor 2 in FIG. 2A. Select transistors ST1, ST2 shown in FIG.3A have the same structure as the select transistor 3 in FIG. 2A.

As is shown in FIG. 3A, the memory cell array comprises a plurality ofmemory blocks MB (NAND cells). Each memory block MB includes an n-number(n is a natural number) of memory cells MC, a drain-side selecttransistor ST1 and a source-side select transistor ST2. Adjacent ones ofmemory cells MC share their source and drains, and the current paths ofthe memory cells MC are connected in series. The select transistor ST1is connected to one end (drain side) of the current path of theseries-connected memory cells MC, and the select transistor ST2 isconnected to the other end of the current path.

The gates of the memory cells MC are connected to control gate lines CG1to CGn (word lines WL1 to WLn). The gate of the drain-side selecttransistor ST1 is connected to a select gate line SGD, and the gate ofthe source-side select transistor ST2 is connected to a select gate lineSGS.

The source of the select transistor ST1 in each memory block isconnected to an associated one of bit lines BL1 to BLm (m is a naturalnumber) that are data lines. The source of the source-side selecttransistor ST2 is connected to a common source line SL.

Although not shown, a plurality of memory blocks MB are provided in adirection along the bit lines BL1 to BLm, and a plurality of memoryblocks MB are connected to each of the bit lines BL1 to BLm. Similarly,memory blocks MB are provided for the respective bit lines BL1 to BLm ina direction along the control gate lines CG1 to CGn.

Both the select transistors ST1 and ST2 are not always necessary. Onlyone of them may be provided if the memory cell blocks MB can beselected.

The planar configuration of the memory cell array will now be describedwith reference to FIG. 3B. FIG. 3B is a plan view of the memory cellarray shown in FIG. 3A.

As is shown in FIG. 3B, a plurality of active areas 21 in stripe shapesare provided in parallel. Source and drain regions are formed in theactive areas 21. Element isolation regions 22 are provided between theactive areas 21. Gate electrodes 7 of memory cells MC are provided instripe shapes in parallel so as to intersect the striped active areas 21at right angles. Moreover, gate electrodes 13 of a pair of selecttransistors ST1 and ST2 are provided in parallel to the gate electrodes7 of memory cells MC so as to sandwich the gate electrodes 7.

In FIG. 3B, impurities are implanted in a region 20 of the semiconductorsubstrate. Parts of the region 20 function as channel regions of thememory cell transistors. Opening portions 16, as described withreference to FIG. 2A, are provided near intersections between the gateelectrodes 13 of select transistors ST1 and ST2 and the active areas 21.Impurities are doped in the silicon substrate through the openingportions 16. The regions doped with impurities function as channelregions of the select transistors ST1 and ST2, and have an impurityconcentration different from that of the channel regions of the memorycell transistors.

The sources and drains of adjacent ones of the memory cells MC arecommonly connected. Thus, more than two memory cells MC have theircurrent paths connected in series, and constitute one memory block (NANDcell).

A cross-sectional structure of the above-described memory cell arraywill now be described. FIG. 2A is a cross-sectional view taken alongline 2-2 in FIG. 3B, so a description of the cross-sectional structure,as viewed along line 2-2, is omitted. FIG. 3C is a cross-sectional viewtaken along line 3C-3C in FIG. 3B, which shows, in particular, across-sectional structure of the select transistor ST1.

As is shown in FIG. 3C, the element isolation regions 22 are provided inthe semiconductor substrate 1, with their top portions projecting fromthe surface of the substrate 1. The channel diffusion layers 19 areformed on the surface of the semiconductor substrate 1 between theelement isolation regions 22. The gate insulating films 6 are formed onthe channel diffusion layers 19. The material of the gate insulatingfilm 6 is, e.g. silicon oxide or oxy-nitride. The charge storage layers14 are provided on the gate insulating films 6, with their top portionsbeing at a level higher than the top surfaces of element isolationregions 22. The inter-gate insulating film 15 is formed on the topsurfaces of charge storage layers 14 and element isolation regions 22.The control gate electrode 17 is formed on the inter-gate insulatingfilm 15. The control gate electrodes 17 and charge storage layers 14 ofselect transistors ST1 and ST2 are electrically connected to constituteselect gate lines SGD and SGS.

FIG. 3D is a graph showing the channel-length-dependency of thethreshold voltages of the select transistor ST1 (ST2) and memory celltransistor MC according to this embodiment of the invention. Asmentioned above, the impurity concentration in the channel region of theselect transistor ST1, ST2 differs from that in the channel region ofthe memory cell transistor MC. As a result, as shown in FIG. 3D, thethreshold voltage of the memory cell transistor MC is lower than that ofthe select transistor ST1, ST2 when the channel length is equal.

If the channel length decreases to a certain level, the thresholdvoltage of each transistor sharply decreases. In FIG. 3D, the thresholdvoltage of the select transistor ST1, ST2 sharply decreases at point Al,and that of the memory cell transistor at point A2 (A2>A1). Thecharacteristics of the transistors are unstable in the region where thechannel length is less than point A1, A2. Thus, in advance of shipmentof finished products, the channel lengths of the select transistor ST1,ST2 and memory transistor MC are designed to be greater than points A1and A2.

The number of memory cell transistors within the memory cell array isvery large, compared to that of other transistors. Miniaturization ofsemiconductor memory devices necessitates reduction in channel length ofmemory cell transistors. The channel length of the select transistor isdesigned to be greater than that of the memory cell transistor. Thereby,the threshold voltage of the select transistor can be made higher thanthat of the memory cell transistor, and thus the select transistor canhave necessary cut-off characteristics.

According to the present embodiment, as described above, theminiaturization of select transistors can be realized. Morespecifically, the select transistor can be reduced in size by virtue ofthe provision of the opening portion 16 between the charge storage layer14 and control gate 17 of the select transistor. Making use of theopening portion 16, ion implantation in the channel region of the selecttransistor can be effected in a self-alignment manner. In the prior art,when impurity ions are implanted in the channel regions of a memory celltransistor and a select transistor in different steps, there arerestrictions on the precision of fine processing, such as the need fordimenision control or alignment error control in lithography. In thepresent embodiment, these restrictions are cleared by the self-alignedion implantation. Therefore, the select transistor can be reduced insize.

The select transistor has a channel length different from that of thememory cell transistor. This makes the threshold voltage of the selecttransistor different from that of the memory cell transistor. Inaddition, the impurity concentration in the channel region of the selecttransistor is controlled independently of the memory cell transistor bythe ion implantation using the opening portion 16. Thus, the cut-offcharacteristics of the select transistor can be enhanced. Moreover, thedegradation in switching characteristics of the select transistor due tothe reduction in channel length can be compensated. Therefore, ashort-channel effect in the select transistor can be suppressed.Accordingly, the memory cell array can be further miniaturized with ahigher integration density.

Besides, the impurity concentration in the channel region of the selecttransistor can be made higher than that in the channel region of thememory cell transistor, while the channel length of the selecttransistor is made greater than the channel length of the memory celltransistor. Hence, the threshold voltage of the select transistor ismade higher than that of the memory cell transistor. Therefore, thesemiconductor memory device including the select transistor withnecessary cut-off characteristics (current cut-off characteristics) canbe realized.

The opening portion 16 is provided between the floating gate 14 andcontrol gate 17, whereby the impurity concentration in the channelregion of the select transistor is made different from that in thechannel region of the select transistor. Therefore, a miniaturizedsemiconductor memory device can be realized, which includes a selecttransistor with a channel region of a required high impurityconcentration and a memory cell transistor with a channel region of alow impurity concentration suitable for miniaturization. Accordingly,the memory cell transistor can be furnished with improvedcharacteristics such as data write characteristics, data holdcharacteristics, and resistance to read-out stress.

A method of manufacturing the semiconductor device with theabove-described structure will now be described with reference to FIGS.4A and 4B through FIGS. 15A and 15B. FIGS. 4A and 4B through FIGS. 15Aand 15B are cross-sectional views successively illustrating the steps offabricating a NAND type flash memory. FIG. 4A through FIG. 15A showcross-sections taken along line 2-2 in FIG. 3B, and FIG. 4B through FIG.15B show cross-sections taken along line 3C-3C in FIG. 3B.

As is shown in FIGS. 4A and 4B, a sacrificial silicon oxide film 30 isformed on a semiconductor substrate 1, e.g. a p-type silicon substrate.The sacrificial silicon oxide film 30 serves to protect the surface ofthe semiconductor substrate 1 from damage due to ion implantation. Then,depending on cases, impurities are ion-implanted in the semiconductorsubstrate 1. The implanted impurities are activated to form a p-well ora double well comprising an n-well and a p-well.

Then, an ion-implanted layer 31 is formed by effecting channel ionimplantation on the surface of the semiconductor substrate 1, or thesurface of the well when the well is formed. Impurities to be implantedare changed in accordance with the conductivity type of the memory celltransistor or select transistor. For example, when the conductivity ofthe transistor is n-type, p-type impurities such as boron areintroduced. The ion implantation is performed for channel control of thetransistor. The ion implantation is effected simultaneously on formationregions of the memory cell transistor and select transistor.

Subsequently, as shown in FIGS. 5A and 5B, the sacrificial silicon oxidefilm 30 is removed, and a gate insulating film 6 is formed on thesemiconductor substrate 1. A floating gate electrode layer 32 is thenformed by depositing, e.g. polysilicon as an electrode material of thefloating gate electrode. Since the floating gate electrode layer 32needs to be electrically conductive, the polysilicon to be used is, e.g.phosphorus-doped polysilicon. Of course, after undoped polysilicon isdeposited, phosphorus may be ion-implanted. Then, a mask material 33such as silicon nitride film (Si₃N₄) is formed on the floating gateelectrode layer 32. The mask material 33 is used in order to form aelement isolation region.

A resist (not shown) is coated on the mask material 33, and the resistis patterned to have a pattern of the element isolation region byphotolithography. Using the patterned resist as a mask, the maskmaterial 33 is patterned. Further, using the patterned mask material 33as a mask, the floating gate electrode layer 32, gate insulating film 6and semiconductor substrate 1 are etched. The etching is usuallyperformed by RIE (Reactive Ion Etching). Thereby, a trench (not shown)for the element isolation region, which extends from the surface of maskmaterial 33 to the semiconductor substrate 1, is formed. The depth ofthe trench is, e.g. about 0.25 μm. The side bottom walls of the trenchare oxidized at high temperatures to form thermal silicon oxide filmsthereon. These thermal oxide films are formed for the purposes ofremedying a damage due to etching or protecting interfaces of therespective layers, or for other purposes. Silicon oxide films 34 forelement isolation are deposited in the trenches by, e.g. CVD (ChemicalVapor Deposition). In this case, for instance, HDP-CVD (High DensityPlasma-CVD) is employed. Then, the deposited silicon oxide films 34 areplanarized to make the top surface of the mask material 33 flush withthe top surfaces of silicon oxide films 34. In this planarizing step,CMP (Chemical Mechanical Polishing) is usually used, but an etching-backmethod may alternatively be used. In the case of the planarization usingCMP, the silicon nitride film that is the mask material 33 is used as astopper film for CMP. Then, the silicon oxide film 34 is made denser byannealing. Thereby, the crystallinity of the silicon oxide films 34 ismade closer to that of the thermal silicon oxide films, thereby makingthem into high-quality silicon oxide films. As a result, a structure asshown in FIGS. 6A and 6B is obtained.

In the following step shown in FIGS. 7A and 7B, the mask material 33 isremoved. Top portions of the silicon oxide films 34 are etched away bymeans of RIE or wet etching. Thus, the formation of element isolationregions 22 is completed.

In FIGS. 8A and 8B, an inter-gate insulating film 35 is deposited on theexposed surfaces of the element isolation regions 22 and floating gateelectrode layer 32. For instance, an ONO film is used as the inter-gateinsulating film 35.

In FIGS. 9A and 9B, a mask material 36 is deposited on the inter-gateinsulating film 35. The mask material 36 may be formed of, e.g.polysilicon or silicon oxide.

In FIGS. 10A and 10B, a resist 37 is coated on the mask material 36. Theresist 37 is patterned by photolithography, thereby removing thatportion of the resist 37 which corresponds to at least a portion of achannel formation region of the select transistor. As a result, anopening portion 38 is made.

As is shown in FIGS. 11A and 11B, that portion of the mask material 36,which is located just under the opening portion 38, is etched away byusing the resist 37 as a mask. The step of etching the mask material 36is effected by, e.g. Deep UV (Ultraviolet) lithography. This methodemploys a short-wavelength light source and thus realizes patterningwith very high precision. Hence, an alignment error between the maskmaterial 36 and opening portion 38 is limited to a minimum.Consequently, the inter-gate insulating film 35 is exposed at the bottomof the opening portion 38.

In FIGS. 12A and 12B, impurities are ion-implanted in that region of thesemiconductor substrate 1, which is to become the channel region of theselect transistor. Thus, a channel diffusion layer 19 is formed. In theion implantation step, impurities are introduced into the substrate 1via the inter-gate insulating film 35, floating gate electrode layer 32and gate insulating film 6. The kind of impurities varies depending onthe conductivity type of the select transistor. In the case of ann-channel type, boron may be used. In the case of a p-channel type,phosphorus may be used. The ion implantation is effected withoutremoving the resist 37, since it serves as a buffer material for ionimplantation.

In this step, the mask material 36 is present in the region where thememory cell transistor is to be formed. The thickness of the maskmaterial 36 is set such that a energy of the implanted ion is decayed inthe material 36 sufficiently. Consequently, the ions may be captured inthe mask material 36 of the memory cell transistor. At the same time,the acceleration energy for ion implantation is adjusted such that theions may penetrate the floating gate electrode layer 32 and reach thesemiconductor substrate 1 in the region where the select transistor isto be formed.

As shown in FIGS. 13A and 13B, the inter-gate insulating film 35 underthe opening portion 38 is etched away. The ion implantation for formingthe channel diffusion layer 19, as illustrated in FIGS. 12A and 12B, maybe performed after etching the inter-gate insulating film 35 in thisstep. However, if the ion implantation is performed with the inter-gateinsulating film 35 remaining, the surface of the floating gate electrodelayer 32 is protected from contamination. The reason is that theinter-gate insulating film 35 functions as a protection film for thefloating gate electrode layer 32.

In FIGS. 14A and 14B, the mask material 36 is removed. A control gateelectrode material 39 is formed on the inter-gate insulating film 35.The control gate electrode material 39 includes, e.g. a polysilicon filmand a metal silicide film such as a WSi (Tungsten Silicide). Of course,it may comprise only the polysilicon film, without the metal silicidefilm. Alternatively, a multi-layer structure including a polysiliconfilm and a metal silicide film may be formed in the memory celltransistor formation region, while a structure comprising only thepolysilicon film may be formed in the select transistor formationregion.

Then, the control gate electrode material 39, inter-gate insulating film35 and floating gate electrode layer 32 are patterned usingphotolithography and anisotropic etching such as RIE. As a result, asshown in FIGS. 15A and 15B, the gate electrode 7 of the memory celltransistor MC, which includes the charge storage layer 8, inter-gateinsulating film 9 and control gate 10, is formed. In addition, the gateelectrode 13 of select transistor ST1, ST2, which includes the chargestorage layer 14, inter-gate insulating film 15 and control gate 17, iscompletely formed. When the control gate electrode material 39 is formedas the polysilicon film in the step of FIGS. 14A and 14B, the silicidefilm may be formed using salicide (Self-Aligned Silicide) after thepatterning in this step.

Thereafter, using the stacked-structured gate electrodes 7 and 13 asmasks, impurities are ion-implanted in the semiconductor substrate 1.Thus, the source/drain regions 4, 5 and 12 are formed in thesemiconductor substrate 1, and the structure shown in FIGS. 2 and 3C isobtained.

As has been described above, according to the semiconductor devicefabrication method of this embodiment, a part of the inter-gateinsulating film 15, which electrically isolates the charge storage layer14 and control gate 17, is removed. This process is applied to the gateelectrodes of transistors in a peripheral control system or to the gateelectrodes of select transistors in the memory cell array. By thisprocess, the charge storage layer 14 and control gate 17 areelectrically connected. However, if the condition below is satisfied,impurities can be ion-implanted in the semiconductor substrate throughthe floating gate in this process.

The condition is that the impurities are captured in the mask materialand do not reach the charge storage layer in the memory cell transistor,while the impurities penetrate the charge storage layer and gateinsulating film and reach the semiconductor substrate in the selecttransistor.

Under this condition, the memory cell transistor and select transistorcan have channel regions with different impurity concentrations, andthese channel regions can be formed to have necessary characteristicsfor the respective transistors. The characteristics of the respectivetransistors can be enhanced without additional fabrication steps oflithography, etc. Moreover, the process can be carried out in aself-alignment manner.

Thus, the select transistor with the channel region, which includes aregion having an impurity concentration different from the impurityconcentration in the channel region of the memory cell transistor, canbe formed by the self-alignment process. As has been described in theBACKGROUD OF THE INVENTION, it becomes difficult carry out theconventional method wherein the ion implantation to the channel regionof the memory cell transistor and select transistor respectively areperformed in different steps. In this case, the channel region of theselect transistor has the same impurity concentration profile in thedirection vertical and horizontal to the surface of the semiconductorsubstrate as that of the memory cell transistor. In the method accordingto the embodiment, the step for implanting ions to the semiconductorsubstrate through the opening portion 16 is carried out in the selecttransistor. Consequently, the select transistor has the channel regionwhich has the impurity concentration profile in the direction verticaland horizontal to the semiconductor substrate different to that of thememory cell transistor. In the select transistor, part of ions implantedin the channel ion implantation remains in the gate insulating film 6.This region includes a region just under the opening portion 16.

This embodiment covers not only n-channel transistors, but alsop-channel transistors. The impurities to be ion-implanted for channelcontrol of the memory cell transistor and select transistor are notlimited to boron. Alternatively, phosphorus, for instance, may be used.In addition, an increase in the number of lithography steps is preventedby performing ion implantation after the opening portion 16 has beenformed in the inter-gate insulating film 15.

According to the semiconductor device and the fabrication method thereofin this embodiment, impurity ions are implanted in the channel regionusing the opening portion corresponding in position to the channelregion of the select transistor. Therefore, misalignment in the channelion implantation can effectively be prevented.

Ion implantation in the channel region of the select transistor isperformed in the state in which the memory cell transistor is coveredwith the mask. Thus, the impurity concentration in the channel region ofthe memory cell transistor can be set independently of the channelimpurity concentration in the select transistor.

In the present embodiment, channel regions, etc. are formed in thesemiconductor substrate 1. Alternatively, a well may be formed byimplanting impurities at a low concentration in the active area of thesemiconductor substrate 1. Channel regions may be formed in the well.The NAND cell includes, e.g. eight transistors sandwiched by two selectgates. However, the number of transistors may be chosen between 8 and32, for example. The advantages of this embodiment are conspicuous whenthe inter-gate distance of adjacent memory cell transistors is about 0.2μm or less. This embodiment is directed to the case where thesemiconductor substrate 1 is of p-type and the source/drain region is ofn-type. Needless to say, the semiconductor substrate 1 may be of n-typeand the source/drain region of p-type. The structure of the selecttransistor according to the embodiment is applicable to MOS transistorsincluded in the peripheral circuits.

As has been described above, according to the present embodiment,channel impurity ion implantation is not effected through the gateinsulating film of the memory cell transistor. Therefore, thecharacteristics of the non-volatile memory with the floating gatestructure, in particular, are not degraded. In the prior art, when thegate insulating film has been degraded by the ion implantation, thedegradation affects data write/erase characteristics and data storagecharacteristics of the memory cell transistor, even if it hardly affectstransistors in the peripheral control system. However, in the presentembodiment, the possibility of degradation of the memory cell transistorcan be eliminated.

The manufacturing method of this embodiment does not require lithographysteps of forming very fine patterns in order to form the channel region.This method requires only conventional lithographic techniquesindispensable for connection between the floating gate and control gatein the select transistor. Accordingly, neither the manufacturing costnor the number of fabrication steps increases. Only with the addition ofthe ion implantation step, can the semiconductor device be obtained,which has the memory cell array that includes the select transistorhaving the channel region formed independently of the memory celltransistor and has fine memory cell transistors arranged at highdensity.

The present embodiment is effectively applicable not only to the casewhere the select transistors and memory cell transistors are regularlyarranged as in the NAND type flash memory, but also to various cellstructures. This embodiment can be carried out with a large degree offreedom, without such a restriction that the relationship between thedistance between adjacent gate electrodes and the stacked structure ofthe gate electrodes should meet a specific geometrical condition for ionimplantation.

FIGS. 16A and 16B are cross-sectional views successively illustratingmanufacturing steps of a semiconductor device according to a firstmodification of the first embodiment. These Figures show, in particular,cross-sectional structures of a NAND type flash memory, as viewed in thedirection of the control gate line CG.

A structure shown in FIGS. 7A and 7B is formed through the fabricationsteps according to the above-described first embodiment. Then, as shownin FIG. 16A, a polysilicon layer 40 doped with, e.g. phosphorus isdeposited on the floating gate electrode layer 32 and element isolationregions 22. The polysilicon layer 40 is then planarized by CMP.

Subsequently, as shown in FIG. 16B, the polysilicon layer 40 ispatterned by photolithography and etching. As a result, as shown in FIG.16B, the polysilicon layer 40 is isolated on the element isolationregions 22 in the direction of the control gate line CG, and endportions of the isolated portions are left on the element isolationregions 22. In this manner, a charge storage layer with a multi-layerstructure comprising the floating gate electrode layer 32 andpolysilicon layer 40 is obtained. Then, an inter-gate insulating film 35of, e.g. ONO film, is deposited on the polysilicon layer 40 and elementisolation regions 22.

Thereafter, the same steps as illustrated in FIGS. 9A and 9B and thefollowing Figures in connection with the first embodiment are carriedout.

According to the manufacturing method of this modification, after themask material 33 is removed, the polysilicon layer 40 is additionallydeposited. Thereby, the thickness of the charge storage layer is madegreater than in the first embodiment, and the distance between the topsurface of the charge storage layer and the top surface of the elementisolation region is increased. Compared to the first embodiment, thesurface area of the charge storage layer, which contacts the inter-gateinsulating film, is enlarged. Specifically, the surface area increasesby a degree corresponding to the distance between the top surface of thecharge storage layer and the top surface of the element isolationregion. Accordingly, the charge storage capacity in the memory cellsection increases. Therefore, the memory capacity of the memory cellsection can be adjusted by controlling the thickness of the chargestorage layer, that is, by controlling the thickness of the polysiliconlayer 40.

FIGS. 16C and 16D are cross-sectional views successively illustratingfabrication steps of a semiconductor device according to a secondmodification of the first embodiment. FIGS. 16C and 16D show, inparticular, a cross-sectional structure of a NAND type flash memory, asviewed along the bit line BL.

A structure as shown in FIG. 9A is formed through the steps described inconnection with the first embodiment. Then, through the stepsillustrated in FIGS. 10A and 11A, the resist 37 and mask material 36 arepatterned to form the opening portion 38. In the first embodiment, oneopening portion 38 is formed for one select transistor. In thismodification, however, a plurality of opening portions 38 are formed forone select transistor as shown in FIG. 16C. Then, impurities areion-implanted via the opening portions 38 into the semiconductorsubstrate 1. As a result, a plurality of channel diffusion layers 19 areformed in the semiconductor substrate 1.

Subsequently, a gate electrode 13 as shown in FIG. 16D is formed throughthe steps illustrated in FIGS. 13A and 14A. As is shown in FIG. 16D, thegate electrode 13 has three connection portions 16.

A plurality of connection portions 16 may be formed, as in thismodification. In FIG. 16D, a plurality of channel diffusion layers 19are provided. In usual cases, these channel diffusion layers become onebody through many thermal steps. As a result, this channel region, too,has an impurity concentration profile as shown in FIG. 2B.

FIG. 17 is a cross-sectional view of a semiconductor device according toa third modification of the first embodiment of the invention. FIG. 17shows, in particular, a cross-sectional structure of a NAND type flashmemory, as viewed in the direction of the control gate line CG.

In the first embodiment, in the steps of FIGS. 10A and 10B, the openingportion 38 is formed to be less than the gate electrode 13. In the thirdmodification, however, the opening portion 38 is formed to be equal insize to the gate electrode of the select transistor, as shown in FIG.17. Thus, a select transistor 47 having a gate electrode 46, in whichthe inter-gate insulating film 35 is completely removed, is formed.Moreover, a channel region 45 having the same length as the gateelectrode 46 is formed.

A semiconductor device according to a second embodiment of the inventionwill now be described with reference to FIG. 18. FIG. 18 is a circuitdiagram of a memory cell array of an AND type flash memory. In thesecond embodiment, the semiconductor device of the first embodiment isapplied to an AND type flash memory, instead of a NAND type flashmemory.

The memory cell array, as shown in FIG. 18, comprises a plurality ofmemory blocks MB (AND cells). Each memory block MB comprises an n-number(n is a natural number; n=4 in FIG. 18) of parallel-connected memorycell transistors MC, a drain-side select transistor ST1, and asource-side select transistor ST2. The memory cell transistors MCcomprise gates connected to control gate lines CG1 to CG4 (WL1 to WL4),respectively; drains commonly connected to a local drain line LD; andsources commonly connected to a local source line LS. The drain-sideselect transistor ST1 comprises a gate connected to a select gate lineSGD, a drain connected to bit lines BL1, BL2, . . . , and a sourceconnected to the local drain line LD. The source-side select transistorST2 comprises a gate connected to a select gate line SGS, a drainconnected to the local source line LS, and a source connected to acommon source line SL. The drain-side and source-side select transistorsST1 and ST2 have the same structure as the select transistor describedin connection with the first embodiment.

The structure shown in FIGS. 2 and 17 according to the first embodimentis directly applicable to the memory cell transistor MC and selecttransistor ST1, ST2 of the AND type flash memory. In addition, themanufacturing method illustrated in FIGS. 4A and 4B through FIGS. 16Aand 16B is directly applicable. With the flash memory of the secondembodiment, like the first embodiment, the flash memory can be reducedin size, while the cut-off characteristics of the select transistor areenhanced.

The first and second embodiments are generally applicable tonon-volatile semiconductor memory devices including select transistors.In addition, these embodiments are applicable not only to semiconductormemory devices but also to MOS transistors in peripheral circuits.Moreover, these embodiments are applicable to memory-embeddedsemiconductor devices.

A semiconductor device according to a third embodiment of the presentinvention will now be described, taking a NAND type flash EEPROM as anexample. FIG. 19A is a block diagram schematically showing the structureof the NAND type flash EEPROM. FIG. 19B is a circuit diagram of a memorycell array and a row core circuit.

As is shown in FIGS. 19A and 19B, a NAND type flash EEPROM 60 comprisesa memory cell array 61, an input/output (I/O) circuit 62, a senseamplifier 63, an address register 64, a column decoder 65, a row decoder66, and a high-voltage generating circuit 67.

The memory cell array 61 is divided into an m-number of memory cellblocks BLK1 to BLKm. In each of the memory cell blocks BLK1 to BLKm,NAND cells as shown in FIG. 19B are arranged. Each NAND cell includes aplurality of memory cells MC (the number of memory cells being 16 inFIG. 19B, but not limited). The memory cells MC are connected in seriessuch that adjacent ones of them share their sources and drains. Thedrain at one end of the NAND cell is connected to a bit line (dataline), BL1 to BLn, via a select transistor ST1. The source at the otherend of the NAND cell is connected to a source line SL via a selecttransistor ST2. Select gate lines SGD and SGS extending in the rowdirection of the memory cell array 61 are connected to the selecttransistors ST1 and ST2 in the same rows. Similarly, word lines WL1 toWL16 extending in the row direction of the memory cell array 61 areconnected to control gate lines CG1 to CG16 of the memory cells in thesame rows. In the case of the NAND type flash EEPROM, one page is formedby n-bit memory cells MC connected to one word line WL. In turn, 16pages form one of the memory cell blocks BLK1 to BLKm. Data write/readfor the memory cell array 61 is effected in units of a page, while dataerase is effected in units of a block.

The I/O circuit 62 receives various commands, address signals, and celldata to be written. The I/O circuit 62 outputs data that has been readout of the memory cell array 61 and latched in the sense amplifier 63.Row address signals and column address signals input to the I/O circuit62 are supplied to the address register 64 and latched therein.

The column address signal latched in the address register 64 is suppliedto the column decoder 65 and decoded. The row address signals latched inthe address register 64 (block address signal, page address signal) aresupplied to the row decoder 66 and decoded.

The sense amplifier 63 latches cell data that has been input to the I/Ocircuit 62 at the time of write. At the time of read-out, the senseamplifier 63 latches cell data that has been read out to the associatedbit line from the selected memory cell block, BLK1 to BLKm, in thememory cell array 61.

The row decoder 66 comprises a row main decoder circuit (not shown) anda row core circuit (row sub-decoder) 68 associated with the memory cellblocks BLK1 to BLKm. The row core circuit 68 is a circuit for supplyingpredetermined voltages to the select gate lines SGD and SGS and 16 wordlines WL1 to WL16 of the selected block. The row core circuit 68comprises transfer gate transistors TGTD, TGTS and TGT. The gateelectrodes TG of the transfer gate transistors TGTD, TGTS and TGT arecommonly connected. The drains of these transfer gate transistors areconnected to the select gate lines SGD and SGS and control gate linesCG1 to CG16. Voltages corresponding to page address signals are suppliedfrom the row main decoder circuit to the sources of these transfer gatetransistors.

The high-voltage generating circuit 67 supplies high voltages to the rowdecoder 66 and memory cell array 61 in accordance with input commandsignals.

The planar patterns and cross-sectional configurations of the memorycell array and row core circuit will now be described with reference toFIGS. 19C to 19G. FIG. 19C is a plan view of the row core circuit andNAND cell. FIGS. 19D and 19E are cross-sectional views of the NAND cell.FIG. 19D is a cross-sectional view taken along line 19D-19D in FIG. 19C,and FIG. 19E is a cross-sectional view taken along line 19E-19E in FIG.19C. FIGS. 19F and 19G are cross-sectional views of the row corecircuit. FIG. 19F is a cross-sectional view taken along line 19F-19F inFIG. 19C, and FIG. 19G is a cross-sectional view taken along line19G-19G in FIG. 19C.

The structure of the memory cell array will first be described. As isshown in FIGS. 19C to 19E, a plurality of strip-like active areas AA areprovided in a silicon substrate 70. Element isolation regions STI areprovided between adjacent active areas AA. A polysilicon layer 72, whichwill become a floating gate FG of the memory cell MC and parts of selectgates SGD and SGS of the select transistors ST1 and ST2, is formed onthe active areas AA with a gate insulating film 71 interposedtherebetween. The gate insulating film 71 is formed of, e.g. a siliconoxide film or oxy-nitride film. A polysilicon layer 74 is provided overthe active area AA and element isolation region STI in a directioncrossing the active area AA. The polysilicon layer 74 is provided overthe polysilicon layer 72, with an inter-gate insulating film 73interposed. The inter-gate insulating film 73 is formed of, e.g. athree-layer ONO film comprising a silicon oxide film, a silicon nitridefilm and a silicon oxide film, or a single-layer film of a silicon oxidefilm, or a two-layer ON film or NO film comprising a silicon oxide filmand a silicon nitride film. The polysilicon layer 74 will become theword lines WL1 to WL16 of memory cells MC and parts of the select gatelines SGD and SGS of select transistors ST1 and ST2. Impurity diffusionlayers 75, which will become sources and drains, are provided in thesilicon substrate 70. Thus, the memory cells MC and select transistorsST1 and ST2 are formed. The polysilicon layers 72 and 74 of selecttransistors ST1 and ST2 are electrically connected in a shunt region(not shown), etc.

An interlayer insulating film 76 is provided over the silicon substrate70 so as to cover the memory cells MC and select transistors ST1 andST2. In the interlayer insulating film 76, a metal wiring layer 77 isprovided. The metal wiring layer 77 is connected via a contact hole Clto the drain region of the selector transistor ST1 having the selectgate line SGD. The metal wiring layer 77 serves as the bit line BL.Moreover, an interlayer insulating film 78 is provided on the interlayerinsulating film 76 so as to cover the bit line BL.

As described above, an n-number of NAND cells each including 16 memorycells MC and selector transistors ST1 and ST2 are arranged in thedirection of the word lines, with the element isolation regions STIinterposed. Thereby, one memory cell block BLK is formed. The memorycell array comprises an m-number of memory cell blocks BLK1 to BLKm.

The word lines WL1 to WL16 in the memory cell array with the abovestructure are connected to the control gate lines CG1 to CG16. Thecontrol gate lines CG1 to CG16 and select gate lines SGD and SGS are ledout to the row core circuit 68.

The structure of the row core circuit 68 will now be described withreference to FIGS. 19C, 19F and 19G.

As is shown in the Figures, a plurality of active areas AA are providedin a matrix in a region adjoining the memory cell array on the siliconsubstrate 70. Element isolation regions STI are provided betweenadjacent active areas AA. Transfer gate transistors TGTD, TGTS, TGT,TGT, . . . , are individually formed on the electrically isolated activeareas AA, respectively. Each transfer gate transistor comprises a gateinsulating film 71 provided on the active area AA, a polysilicon layer72 provided on the gate insulating film 71, an inter-gate insulatingfilm 73 provided on the polysilicon layer 72, a polysilicon layer 74provided on the inter-gate insulating film 73, and impurity diffusionlayers 75 provided in the active area AA. The polysilicon layers 72 and74 are a gate electrode TG of the transfer gate transistor, and both areelectrically connected on the active area AA.

The number of columns of active areas AA in the row core circuit 68 is,e.g. four. The gate electrodes TG of the four transfer gate transistorsprovided in the active areas AA in the same row are commonly connected.

The impurity diffusion layers (drain regions) 75 of the transfer gatetransistors TGTD, TGTS, TGT, TGT, . . . , are connected to associatedselect gate lines SGD and SGS and control gate lines CG1 to CG16. Inother words, the select gate lines SGD and SGS and control gate linesCG1 to CG16 are led out to the active areas AA, on which the associatedtransfer gate transistors are provided, by shunt wiring elements 79 (M0)provided in the interlayer insulating film 76, and are connected to theimpurity diffusion layers 75 of the associated transfer gate transistorsvia contact holes C2. In addition, the impurity diffusion layers (sourceregions) 75 of the transfer gate transistors TGTD, TGTS, TGT, TGT, . . ., are connected to the row main decoder by a metal wiring layer 80. Viathe metal wiring layer 80, voltage is applied from the row main decoderto the source regions of the transfer gate transistors.

In the row core circuit 68 with the above structure, the transfer gatetransistors TGTD and TGTS connected to the select gate lines SGD and SGSare formed in the active area AA formed at the endmost column within therow core circuit. In the example shown in FIG. 19C, the transfer gatetransistors TGTD and TGTS are provided in the active areas AA arrangedin the column closest to the row main decoder within the row corecircuit 68. The group of active areas AA in this column closest to therow main decoder is referred to as an active area group AA(ST).

Only the transfer gate transistors TGT, which are connected to thecontrol gate lines CG1 to CG16, are provided in the active areas AAarranged in the first to third columns on the side of the memory cellarray 61. In other words, the transfer gate transistors TGTD and TGTSare not formed in the active areas AA of the second to fourth columns,as counted from the row main decoder side. The groups of active areas AAof the second to fourth columns, as counted from the row main decoderside, are referred to as active area groups AA(MC).

A width d1 of the element isolation region STI between the active areagroup AA(ST) and the adjacent active area group AA(MC) is greater than awidth d2 of the element isolation region STI between adjacent activearea groups AA(MC) (d1>d2).

As described above, the row core circuit 68 is formed and connected tothe memory cell array 61 and row main decoder.

The operation of the NAND type flash EEPROM will now be described inbrief with reference to FIG. 20A. FIG. 20A is a table showing therelationship between potentials of the select gate lines and controlgate lines in the write, read and erase modes of the NAND type flashmemory. As mentioned above, the write and read for the memory cell array61 are effected in units of a page, and the erase is effected in unitsof a block. The data write operation will first be described, taking aSB (Self Boost) method by way of example, referring to FIG. 20B. FIG.20B is a circuit diagram of a NAND type flash memory in the write mode.

The data write is successively effected from the memory cell MC remotestfrom the bit line BL. In the following description, assume that data isto be written in memory cells MC14, MC24 and MC34 connected to a controlgate line CG14, as shown in FIG. 20B. To begin with, a voltage Vpp(e.g.20V) is applied to the gate electrodes TG of all transfer gatetransistors corresponding to the selected memory cell block, BLK1 toBLKm. Thereby, the transfer gate transistors TGTD, TGTS, TGT, TGT, . . ., are turned on. Then, the row main decoder applies a write voltage Vpp(e.g. 20V) to the source regions of the transfer gate transistors TGT,TGT, . . . , which are connected to memory cells MC to be selected. Therow main decoder applies an intermediate potential Vpass (e.g. 7V) tothe source regions of the other (unselected) transfer gate transistors.Furthermore, voltages Vcc (e.g. 3V) and 0V are applied to the sourceregions of the transfer gate transistors TGTD and TGTS. In the state inwhich voltage Vcc is applied to the select gate line SGD of the selecttransistor ST1, Vpp to the control gate line CG14 of the selected memorycell, Vpass to the control gates CG1 to CG13, CG16 of the unselectedmemory cell, and 0V to the select gate line SGS of select transistorST2, the bit lines BL1 to VL3 are supplied with 0V or intermediatepotential Vcc (e.g. 3V) in accordance with data. When 0V is applied tothe bit line BL, this potential is transferred to the drain of theselected memory cell MC24, and electrons are injected in the floatinggate FG. Thereby, the threshold voltage of the selected memory celltransistor is shifted to the positive side. This state is the state inwhich data “0” is written. On the other hand, when intermediatepotential Vcc is applied to the bit lines BL1, BL3, no injection ofelectrons into the floating gates FG of the memory cells MC14, MC34substantially occurs and the threshold voltage does not change andremains at a negative level. This state is the state in which data “1”is written. The data write is simultaneously effected for all memorycells MC that share the control gate line CG.

Aside from the SB method, there are known an LSB (Local Self Boost)method and an ESB (Erased area Self Boost) method as data write methods.These methods are devised to prevent erroneous data write to memorycells connected to a unselected bit line. FIGS. 20C and 20D are circuitdiagrams of NAND type flash memories in the write mode using the LSBmethod and ESB method, respectively.

The LSB method will now be described referring to FIGS. 20A and 20C.Assume that data “0” is written in the memory cell MC24 alone. In theLSB method, a voltage of 0V is applied to unselected control gate linesCG13 and CG15 adjacent to the selected gate line CG14. In the otherrespects, the LSB method is the same as the SB method. Since thepotential of control gate lines CG13 and CG15 is 0V, the channelpotential of the memory cell MC14, MC34 is in the floating state. Avoltage Vpp is applied to the control gate line CG14. Accordingly, thechannel potential of memory cell MC14, MC34 is boosted up to Vpp bycapacitive coupling with the control gate line CG14. As a result, noelectrons are injected in the floating gate FG, and data “1” is exactlywritten in the memory cell MC14, MC34.

The ESB method will now be described referring to FIGS. 20A and 20D. Inthe following description, too, assume that data “0” is to be written inthe memory cell MC24. In the ESB method, a voltage of 0V is applied onlyto the unselected control gate line CG15 that is next to the selectedcontrol gate line CG14. An intermediate potential Vpass is applied tothe other unselected control gate lines CG1 to CG13 and CG16. Payingattention to the bit line BL1, BL3 supplied with Vcc, the channelpotential of the memory cell connected to the control gate line CG1 isboosted to Vcc+a by the capacitive coupling with the control gate lineCG1. The same applies to the memory cells connected to the control gatelines CG2 to CG13. As a result, the channel potential of the memory cellconnected to the control gate line CG14, too, becomes sufficientlyhigher than Vcc. Thus, no electrons are injected in the floating gate FGof memory cell MC14, MC34, and data “1” is exactly written in the memorycell MC14, MC34.

Also in the case of the NAND type flash memories using the LSB methodand ESB method, a selected control gate line and an unselected controlgate line are arranged not to be adjacent to each other within the rowcore circuit. However, it is inevitable that a selected state and anunselected state are present adjacently between the select gate line andthe control gate line.

The data erase is effected for all bits in the block at the same time.To start with, a voltage Vpp (e.g. 20V) is applied to the gateelectrodes TG of all transfer gate transistors corresponding to aselected one of the memory cell blocks BLK1 to BLKm. Thereby, thetransfer gate transistors TGTD, TGTS, TGT, TGT, . . . , are turned on.Then, the row main decoder applies 0V to all the source regions of thetransfer gate transistors TGT, TGT, . . . , which are connected to thememory cells MC. Thus, the potential of all control gates CG1 to CG16 isset at 0V. The potential of the select gate line SGD, SGS is in thefloating state. In addition, the potentials of all control gate linesand select gate lines of the unselected blocks are in the floatingstate. In this state, a voltage of 20V is applied to the p-well (notshown) in the silicon substrate in which the NAND cells are formed.Thereby, electrons in the floating gates FG of all memory cells MC inthe selected block are released to the p-well. As a result, thethreshold voltage of the memory cell MC shifts to the negative side anddata erase is effected. The potentials of the select gate lines in theselected block and the control gate lines and select gate lines in theunselected block are boosted up to about 20V by the capacitive couplingwith the silicon substrate.

In the data read mode, like the data write and erase, a voltage Vpp(e.g. 20V) is applied to the gate electrodes TG of all transfer gatetransistors corresponding to a selected one of the memory cell blocksBLK1 to BLKm. Thereby, the transfer gate transistors TGTD, TGTS, andTGT, TGT, . . . , are turned on. The row main decoder applies 0V to thesource region of the transfer gate transistor TGT connected to theselected memory cell MC. At the same time, the row main decoder appliesa read-out potential Vread (e.g. 5V) to the source regions of thetransfer gate transistors TGT connected to the unselected memory cellsMC. In addition, the row main decoder applies a voltage Vcc (e.g. 5V) tothe source regions of the transfer gate transistors TGTD and TGTS. Inthe state in which the voltage Vread is applied to the control gatelines of the unselected memory cells, the voltage Vcc is applied to theselect gate lines SGD and SGS of select transistors ST1 and ST2 and 0Vis applied to the control gate lines of the selected memory cells, theread-out operation is performed by detecting whether current flows inthe selected memory cells.

As has been described above, according to the NAND type flash EEPROM ofthis embodiment, the active areas AA, where the transfer gatetransistors TGTD and TGTS are to be formed, are positioned in the columnat the end portion of the row core circuit 68. Specifically, the region,where the transfer gate transistors TGTD and TDTS connected to theselect gate lines and the transfer gate transistors TGT connected to thecontrol gate lines are located adjacent to each other, is provided atthe limited area within the row core circuit (region X1 in FIG. 19C).Consideration for the withstand voltage between the transfer gatetransistors TGTD, TGTS and transfer gate transistors TGT needs to begiven to only the region X1. Therefore, if only the width d1 of theregion X1 is made greater than the width d2 of each of regions X2 wheretransfer gate transistors TGT are arranged adjacent to each other, theelement isolation can be ensured within the row core circuit. In otherwords, the region X1 is the sole element isolation region STI that hasto be widened to maintain the withstand voltage between the transfergate transistors.

This point will further be described with reference to FIGS. 21A and21B. FIG. 21A is a plan view of the row core circuit of the NAND typeflash EEPROM, and FIG. 21B is a cross-sectional view taken along line21B-21B in FIG. 21A. The transfer gate transistors arranged in the samerow in the row core circuit do not necessarily correspond to the samememory block. The reason is that the control gate line connected to thetransfer gate transistors TGT provided in the same row needs to bedesigned to avoid an adjacent occurrence of the selected state andunselected state of control gate lines.

Referring to FIG. 21A, assume that the select gate line SGD10 isconnected to the select transistors in the unselected block. Then, 0V isapplied to the active area AA10 (impurity diffusion layer 75) in whichthe transfer gate transistor TGTD10 connected to the select gate lineSGD10 is provided. On the other hand, assume that the control gate linesCG11 to CG13 connected to the transfer gate transistors TGT11 to TGT13provided in the same row as the transfer gate transistor TGTD10 havebeen selected for data write. Then, a high voltage Vpp is applied to theactive areas AA11 to AA13 (impurity diffusion layer 75) where thetransfer gate transistors TGT11 to TGT13 are provided.

Then, as shown in FIG. 21B, a potential difference of Vpp occurs betweenthe active areas AA10 and AA11. Therefore, the width d1 of the elementisolation region STI between the active areas AA10 and AA11 needs to bemade greater than the width d2 of the element isolation region STIbetween the active areas AA11 and AA12 or between the active areas AA12and AA13.

Then, assume that the select gate line SGD connected to the transfergate transistor TGTD20 provided in the active area AA20 arranged in therow different from the row of the active area AA10 is also associatedwith the unselected block. Then, 0V is applied to the active area AA20.On the other hand, assume that the control gate lines CG21 to CG23connected to the transfer gate transistors TGT21 to TGT23 provided inthe same row as the transfer gate transistor TGTD20 have been selectedfor data write. Then, a high voltage Vpp is applied to the active areasAA21 to AA23 where the transfer gate transistors TGT21 to TGT23 areprovided.

Similarly with FIG. 21B, a potential difference Vpp occurs between theactive areas AA20 and AA21. Therefore, the width d1 of the elementisolation region STI between the active areas AA20 and AA21 needs to bemade greater than the width d2 of the element isolation region STIbetween the active areas AA21 and AA22 or between the active areas AA22and AA23.

As has been described in “BACKGROUND OF THE INVENTION”, the elementisolation region between the transfer gate transistor connected to theselect gate line and the transfer gate transistor connected to thecontrol gate line cannot maintain element isolation, unless the width ofthis element isolation region is made greater than that of the elementisolation region between the transfer gate transistors connected to thecontrol gate line. In the prior art, as described above, the elementisolation region between the transfer gate transistor connected to theselect gate line and the transfer gate transistor connected to thecontrol gate lines is present at random within the row core circuit.

However, in the present embodiment, the transfer gate transistors TGTDand TGTS connected to the select gate lines SGD and SGS are providedonly in the active areas (AA10, AA20) in the same column at the end ofthe row core circuit. Therefore, no problem arises if the width of theelement isolation region between the active areas (AA10, AA20, AA30, . .. ) in the first column in the row core circuit, which is closest to therow main decoder, and the active areas (AA11, AA21, AA31, . . . ) in thesecond column is increased. There is no need to increase the width ofthe other element isolation regions. Therefore, the insulationperformance of the element isolation region can be sufficientlymaintained, while the increase in area of the row core circuit islimited to a minimum.

A semiconductor device according to a fourth embodiment of the presentinvention will now be described with reference to FIGS. 22A to 22C. FIG.22A is a plan view of a row core circuit. FIGS. 22B and 22C arecross-sectional views taken along lines 22B-22B and 22C-22C in FIG. 22A,respectively.

As shown in the Figures, in this embodiment, the gate electrodes TG ofthe transfer gate transistors arranged in the same row in the prior art(see FIGS. 1A and 1B) are separated for the respective transfer gatetransistors. The gate electrodes TG of the transfer gate transistors inthe same row are electrically commonly connected by a metal wiring layerTGMETAL provided at higher level than the gate electrodes TG.

Specifically, as shown in FIGS. 22A to 22C, a polysilicon layer 74,which becomes a part of the gate electrode TG of the transfer gatetransistor, is partly removed down to the inter-gate insulating film 73on the element isolation region STI that isolates the active areas AA.As a result, the gate electrode TG is formed of the polysilicon layers72 and 74 that are separated for each transfer gate transistor. Ametallic wiring layer 82 is provided in an interlayer insulating film 76at a level equal to the level of the select gate lines SGD and SGS andshunt wiring 79 that serves as the control gate line CG. The metallicwiring layer 82 is connected to the gate electrodes TG of the transfergate transistors arranged in the same row by means of plugs 81. In otherwords, the metal wiring layer serves as the wiring TGMETAL for commonlyconnecting the gate electrodes TG of the transfer gate transistorsarranged in the same row.

According to the above structure, at least a part of the gate electrodeTG on the element isolation region STI that isolates the active areas AAis removed. Thus, even if the high voltage Vpp is applied to the gateelectrode TG, it is not applied to the element isolation region STI.Thus, an inversion region is prevented from forming in the siliconsubstrate 70 near the element isolation region STI. Accordingly, elementisolation can be maintained without increasing the width of the elementisolation region.

A semiconductor device according to a fifth embodiment of the inventionwill now be described, taking a NAND type flash EEPROM as an example.FIG. 23A is a plan view of a row core circuit, and FIG. 23B is across-sectional view taken along line 23B-23B in FIG. 23A.

As is shown in the Figures, in a row core circuit 68 of the NAND typeflash EEPROM according to the fifth embodiment, a dummy gate electrode83 is additionally provided between the adjacent transfer gatetransistors arranged along the control gate line CG in the structure ofthe fourth embodiment. Specifically, a polysilicon film 83 is formedalong the bit line BL on the element isolation region STI that isolatesthe active areas AA. The polysilicon film 83 is provided so as to passbetween the adjacent gate electrodes TG arranged along the control gateline CG. The polysilicon film 83 is electrically isolated from the gateelectrode TG by an interlayer insulating film 76. The polysilicon film83 is supplied with 0V or −Vcc, irrespective of the operation state ofthe transfer gate transistor.

According to the above structure, the dummy gate electrode 83 issupplied with 0V or a negative potential. Thus, a parasitic MOStransistor comprising the dummy gate electrode 83, element isolationregion STI and silicon substrate 70 is always turned off. Therefore, aninversion region is effectively prevented from forming in the siliconsubstrate near the element isolation region STI. As a result, elementisolation can be maintained without increasing the width of the elementisolation region. In the meantime, the dummy gate electrode 83 issupplied with 0V or −Vcc when the parasitic MOS transistor is of ann-channel type. When the parasitic MOS transistor is of a p-channeltype, the dummy gate electrode may be supplied with, e.g. +Vcc.

A non-volatile semiconductor memory according to a sixth embodiment ofthe invention will now be described, taking a NAND type flash EEPROM asan example. FIG. 24 is a plan view of a row core circuit.

As is shown in FIG. 24, in the row core circuit of the NAND type flashEEPROM of the sixth embodiment, the transfer gate transistors TGTD,TGTS, TGT, . . . , in the structure of the fourth embodiment as shown inFIG. 22A, is rotated over 90°. Specifically, in each active area AA, thegate electrode TG is formed in a direction (bit line direction)perpendicular to the control gate line CG.

With this structure, too, the same advantages as with the fourthembodiment can be obtained. Needless to say, in the sixth embodiment,like the fifth embodiment., a dummy gate electrode may be providedbetween the adjacent active areas AA arranged along the control gateline.

A non-volatile semiconductor memory according to a seventh embodiment ofthe invention will now be described, taking a NAND type flash EEPROM asan example. FIG. 25 is a plan view of a row core circuit.

As is shown in FIG. 25, in the row core circuit of the NAND type flashEEPROM of the seventh embodiment, the structure of the fourth embodimentas shown in FIG. 22A is changed such that the wiring elements forleading the select gate line and control gate lines out to the row corecircuit are formed on the same level as the word lines of the memorycells. In addition, the gate electrodes TG of the transfer gatetransistors are commonly connected using two metal wiring layersTGMETAL1 (M0) and TGMETAL2 (M1) provided on a level higher than thosewiring elements. For example, the metal wiring layer TGMETAL1 isprovided in the interlayer insulating film 76, and the metal wiringlayer TGMETAL2 in the interlayer insulating film 78.

Unlike the third to sixth embodiments, the metal wiring layers TGMETAL1and TGMETAL2 of this embodiment are commonly connected to the gateelectrodes TG of transfer gate transistors arranged in different rows.For example, as shown in FIG. 25, two metal wiring layers TGMETAL1 andTGMETAL2 are alternately connected to the gate electrodes of thetransfer gate transistors provided in two rows.

If the plural metal wiring layers for commonly connecting the gateelectrodes TG of the transfer gate transistors are arranged to extendover different rows, as described above, the following advantages can beobtained in addition to the advantages of the fourth embodiment: mutualeffects between the transfer gate transistors are suppressed, and theoperational reliability of the transfer gate transistors can beenhanced.

FIG. 26 is an enlarged view of FIG. 25. FIG. 26 omits showing of metalwiring layers TGMETAL1 and TGMETAL2 that connect the gate electrodes TG.Assume, however, that in FIG. 26 the gate electrodes of transfer gatetransistors TGT1, TGT3 and TGT5 are commonly connected and the gateelectrodes of transfer gate transistors TGT2, TGT4 and TGT6 are commonlyconnected. In addition, assume that a voltage Vpass is applied to theactive area AA1 where the transfer gate transistor TGT1 is provided, anda voltage of 0V is applied to the active area AA5 where the transfergate transistor TGT5 is provided.

According to this embodiment, the active areas AA1 and AA5 are adjacentto each other in an oblique direction, that is, neither in the directionparallel to the control gate lines CG nor in the direction perpendicularto the control gate lines CG. Specifically, if the distance betweenhorizontally or vertically adjacent active areas is 1, the distancebetween obliquely adjacent active areas is {square root}{square rootover (2)}. For example, in the above-described LSB method or ESB method,the active area supplied with Vpass and the active area supplied with 0Vare disposed adjacent to each other in the oblique direction. Therefore,the distance between the adjacent active areas can be increased up to{square root}{square root over (2)} of the distance in the ordinarycase, and the insulation between active areas can be improved.

In this embodiment, too, the dummy gate electrode described inconnection with the fifth embodiment can be provided, if the lead-outlines of select gate line SGD (SGS) and control gate lines CG and themetal wiring layers TGMETAL1 and TGMETAL2 are formed in the interlayerinsulating films of the successively higher levels. In this case, theinsulation performance of the element isolation region STI can furtherbe enhanced.

As has been described above, according to the third to seventhembodiments, in the row core circuit of the NAND type flash EEPROM, thetransfer gate transistors connected to the select gate line SGD, SGS,are arranged in the column at the end portion of the row core circuit.Thus, the transfer gate transistor connected to the select gate line andthe transfer gate transistor connected to the control gate line arepositioned adjacent to each other only in the area between the activearea in this column and the adjacent active area. In short, a highwithstand voltage is required only in the element isolation region inthis area. The withstand voltage in this context means a withstandvoltage against formation of a channel region due to a parasitic MOStransistor in the vicinity of the element isolation region. Accordingly,element isolation between columns of active areas can sufficiently beeffected by increasing the width of only the element isolation regionSTI in this area, and keeping the ordinary width of element isolationregions on the other area. Therefore, the insulation performance of theelement isolation region can be enhanced while the increase in area ofthe row core circuit is limited to a minimum.

The gate electrodes of transfer gate transistors are separated for therespective transfer gate transistors. Thus, a high voltage, which turnson the transfer gate transistors, is not applied to the elementisolation region between the columns of the transfer gate transistorsthat are arranged adjacent to each other in the same row. Therefore, thewithstand voltage of the element isolation region can be enhancedwithout increasing the area of the row core circuit. The dummy gateelectrodes are formed on the element isolation regions arranged adjacentto each other in the same row. The potential of the dummy gate electrodeis set at a level that can turn off the parasitic MOS transistor.Therefore, the withstand voltage of the element isolation region canfurther be enhanced.

In the third embodiment, the transfer gate transistor connected to theselect gate line is located, by way of example, at the area closest tothe row main decoder. However, needless to say, this transfer gatetransistor may be located at the area closest to the memory cell array.In the third embodiment, it should suffice if all the transfer gatetransistors connected to the select gate lines are arranged in the samecolumn at the end portion of the row core circuit. Thus, any one of thetransfer gate transistors connected to the control gate lines maypossibly be positioned in the same column as the transfer gatetransistor connected to the select gate line.

In the fourth to seventh embodiments, too, the transfer gate transistorconnected to the select gate line is located, by way of example, at thearea closest to the row main decoder. However, in the fourth to seventhembodiments, the withstand voltage of the element isolation region isenhanced by removing the gate electrode TG on the element isolationregion. Therefore, there is no need to arrange the transfer gatetransistors connected to the select gate lines in the same column at theend portion of the row core circuit. The transfer gate transistorsconnected to the select gate lines may be arranged at random within therow core circuit.

In the seventh embodiment, the metal wiring layer TGMETAL is formed toextend over the active areas of the two rows. Alternatively, it may beformed to extend over active areas of three or more rows.

In the third to seventh embodiments, the NAND type flash EEPROMs havebeen described by way of example. However, this embodiment is generallyapplicable to semiconductor memory devices that face the problem ofinsulation between adjacent active areas.

Additional advantages and modifications will readily occur to thoseskilled in the art. Therefore, the invention in its broader aspects isnot limited to the specific details and representative embodiments shownand described herein. Accordingly, various modifications may be madewithout departing from the spirit or scope of the general inventiveconcept as defined by the appended claims and their equivalents.

1. A method for fabricating a semiconductor device, comprising:implanting impurities of a first conductivity in a surface of asemiconductor substrate at a first concentration; forming a gateinsulating film on the surface of the semiconductor substrate; forming acharge storage layer on the gate insulating film; forming a elementisolation region in the semiconductor substrate and the gate insulatingfilm; forming an inter-gate insulating film on the element isolationregion and the charge storage layer; forming on the inter-gateinsulating film a mask material having an opening portion which exposesat least a part of a surface of the inter-gate insulating film;implanting impurities of the first conductivity type in thesemiconductor substrate via the opening portion in the mask material ata second concentration higher than the first concentration; removing theinter-gate insulating film that is exposed to the opening portion in themask material; forming a control gate electrode on the inter-gateinsulating film, the control gate electrode being connected to thecharge storage layer via a region where the inter-gate insulating filmhas been removed; forming a stacked gate electrode by patterning thecharge storage layer, the inter-gate insulating film and the controlgate electrode; and forming source and drain regions by implantingimpurities of a second conductivity type in the semiconductor substratearound the gate electrode.
 2. The method according to claim 1, whereinthe forming of the mask material on the inter-gate insulating filmincludes: forming the mask material on the inter-gate insulating film;and forming the opening portion in the mask material.
 3. A method forfabricating a semiconductor device, comprising: implanting impurities ofa first conductivity in a surface of a semiconductor substrate at afirst concentration; forming a gate insulating film on the surface ofthe semiconductor substrate; forming a charge storage layer on the gateinsulating film; forming a element isolation region in the semiconductorsubstrate and the gate insulating film; forming an inter-gate insulatingfilm on the element isolation region and the charge storage layer;forming a mask material on the inter-gate insulating film at regionswhere first and second transistors are to be formed, the mask materialhaving an opening portion which exposes at least a part of a surface ofthe inter-gate insulating film at the region where the first transistoris to be formed; implanting impurities of the first conductivity type inthe semiconductor substrate via the opening portion in the mask materialat a second concentration higher than the first concentration; removingthe inter-gate insulating film that is exposed to the opening portion inthe mask material; forming a control gate electrode on the inter-gateinsulating film, the control gate electrode at the region where thefirst transistor is to be formed being connected to the charge storagelayer via a region where the inter-gate insulating film has beenremoved; forming stacked gate electrodes of the first and secondtransistors by patterning the charge storage layer, the inter-gateinsulating film and the control gate electrode; and forming source anddrain regions of the first and second transistors by implantingimpurities of a second conductivity type in the semiconductor substratearound the gate electrode.
 4. The method according to claim 3, whereinthe forming of the mask material on the inter-gate insulating filmincludes: forming the mask material on the inter-gate insulating film;and forming the opening portion in the mask material.